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Package Availability Index

0	=	Not available
1	=	OK for production; prototype is in the same form factor
2	=	OK for production (off-shore assembly only); TAT restriction
4	=	Prototype only; not for production
4A	=	Prototype only with silicone coated wire; not for production
5	=	Consult Engineering/Packaging for special restrictions
6	=	OK; Note: package has more I/O pins than die
7	=	Must pre-order packages/material for production; consult factory for lead time
8	=	OK for production; no laser prototype in same form factor; consult factory for one mask prototyping capability

Package Type Index

PQFP	=	Plastic Quad Flat Pack
TQFP	=	Thin Quad Flat Pack
MQUAD*	=	Metal Quad Flat Pack
EQFP	=	Enhanced Quad Flat Pack
CerQUAD	=	Ceramic Quad Pack
CQFP	=	Ceramic Quad Flat Pack
PBGA	=	Plastic Ball Grid Array
CDEBGA	=	Enhanced Ball Grid Array (Cavity Down)
CPGA	=	Ceramic Pin Grid Array
CDCPGA	=	Ceramic Pin Grid Array (Cavity Down)
CDIP	=	Ceramic Dual In-line Package (Side Braze)
PDIP	=	Plastic Dual In-line Package
CLCC	=	Ceramic Leaded Chip Carrier (J-Bend)
PLCC	=	Plastic Leaded Chip Carrier (J-Bend)
FP	=	Foot Print, mm
e	=	Ball(or Pin) Pitch, mm
S	=	Staggered ball or pin