Multi Project Wafer Runs
EUROPRACTICE reduces the cost for ASIC prototyping by combining several designs
from different customers onto one wafer. This approach, known as Multi-Project
Wafer (MPW), allows the costs to be shared among a number of customers.
Fabrication of prototypes can thus be as low as 5% to 10% of the cost of a full
wafer run. A limited number of tested or untested ASIC prototypes, typically 10-20,
are delivered to the customer for evaluation, either as naked dies or as encapsulated
devices. Only prototypes from fully qualified wafers are taken to ensure that the chips
delivered will function first time right
In order to achieve this, extensive Design Rule and Electrical Rule Checkings are
performed on all designs submitted to the Prototyping Service.
EUROPRACTICE is organising about 90 MPW runs
per year in various technologies.
Most of the participating customers use these runs to get cheap samples for validation
of their self-made designs.
Design Kits
Designers need the necessary information (design rules, electrical parameters,cell library,
etc.) of the chosen technology before they can start the design phase.
All this information
is put together by the foundry in the so-called 'design kit'.
EUROPRACTICE has bundled
all the design kits for the different technologies and CAD tools together on aCD-ROM.
Customers can have a copy of the CD-ROM and the design kits by signing a
non-disclosure agreement (NDA) with EUROPRACTICE.
Prototype testing
In most of the cases our customers test their ASIC samples themselves. But forthose who do not
have this possibility we offer prototype testing.
In order to set up a test solution, we need the testvectors from the customer.The testvectors are
software generated (simulation) or manually made by the designer.
Prototype encapsulation
EUROPRACTICE ASIC service offers encapsulated prototypes.
It is required to supply the prototypes
in a package which is as close as possible to the final ASICs delivered in production. The
packaging is done by industrial assembly houses and the range of prototype
packages includes DIL, SOIC, CLCC, JLCC, PGA, CQFP, etc.
For specific requirements, a solution will be found.