CX3001 Package Capability Matrix (Version 13)

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Package Availability Index

0

=

Not available

1

=

OK for production; prototype is in the same form factor

2

=

OK for production (off-shore assembly only); TAT restriction

4

=

Prototype only; not for production

4A

=

Prototype only with silicone coated wire; not for production

5

=

Consult Engineering/Packaging for special restrictions

6

=

OK; Note: package has more I/O pins than die

7

=

Must pre-order packages/material for production; consult factory for lead time

8

=

OK for production; no laser prototype in same form factor; consult factory for one mask prototyping capability

Package Type Index

PQFP

=

Plastic Quad Flat Pack

TQFP

=

Thin Quad Flat Pack

MQUAD*

=

Metal Quad Flat Pack

EQFP

=

Enhanced Quad Flat Pack

CerQUAD

=

Ceramic Quad Pack

CQFP

=

Ceramic Quad Flat Pack

PBGA

=

Plastic Ball Grid Array

CDEBGA

=

Enhanced Ball Grid Array (Cavity Down)

CPGA

=

Ceramic Pin Grid Array

CDCPGA

=

Ceramic Pin Grid Array (Cavity Down)

CDIP

=

Ceramic Dual In-line Package (Side Braze)

PDIP

=

Plastic Dual In-line Package

CLCC

=

Ceramic Leaded Chip Carrier (J-Bend)

PLCC

=

Plastic Leaded Chip Carrier (J-Bend)

FP

=

Foot Print, mm

e

=

Ball(or Pin) Pitch, mm

S

=

Staggered ball or pin

* "MQUAD" is registered trademark of Olin Corporation



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